UNISTOLE™
Polyolefinic Primers and Adhesives

Polyolefinic primers and adhesives for polypropylenes (PP) and polyolefins

  • heat-sealing properties
  • coating activity
  • secondary adhesiveness
  • heat resistance
  • heat resistant adhesiveness
  • retort treatment
  • pliability
  • gasoline resistance
  • flexibility
  • impact resistance

CHARACTERISTICS

UNISTOLE P

Liquid primer for coating and bonding polypropylene (PP) and various engineering plastics, rubber and other materials, which do not readily bond.

UNISTOLE R

Modified polyolefin dispersed in hydrocarbon-based solvent used as an adhesive for bonding metals to polyolefins. Can also be used as a metal coating agent.

As an adhesive primer

As an adhesive primer

As a printing/paint primer

As a printing/paint primer

Heat sealing for metals

Heat sealing for metals

UNISTOLE™ P Liquid Primer Characteristics

  • An easily handled one-pack primer that dries at normal temperatures so “ wet-on-wet ” coating is possible.
  • Appropriate for coating and bonding almost all paints and adhesives and all types of PP.
  • Suitable as a primer for coating and bonding engineering plastics such as nylon, polyester resin and FRP, rubbers such as EPDM, metals and other materials that do not readily bond.
  • Possesses excellent secondary adhesion and excellent gasoline resistance.
  • A UNISTOLE P coated film is flexible even at low temperatures, and articles coated with it exhibit excellent flex resistance and impact resistance.

UNISTOLE™ R Characteristics

  • Excellent adhesion to various metals.
  • Exceptional heat resistance and heat resistant adhesion.
  • Superb resistance to retort treatment.
  • Useable with simple equipment such as gravure coaters, roll coaters and sprays.

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Grades

Grades of UNISTORE™ P

Grades of UNISTORE™ P

Grades of UNISTORE™ R, H

Grades of UNISTORE™ R, H

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Thermal bonding with metals

Thermal bonding with metals

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Bonding at low temperatures

Bonding at low temperatures

Bonding at low temperatures

Bonding at low temperatures

Bonding at low temperatures