Product Development Laboratory
The Product Development Laboratory serves as one of the development centers in the Performance Materials Business Sector, combining the Company's unique polymer material technology with the latest "film & sheet, coating and lamination" processing technology in its efforts to conduct research and development of various composite materials and components such as the circuit materials, semiconductor process materials, recording materials and optical materials used in the field of information and electronics, in addition to the hygiene materials and industrial materials used in the field of living and energy.
Circuit Materials
In the field of circuit materials, we have developed the NEOFLEX™ flexible substrate based on our proprietary polyimide resin technology. This product has excellent heat resistance and flexure, greatly contributing to reducing the size and increasing the functionality of items such as mobile phones and digital cameras.
Furthermore, our unique polymer compounding technology has enabled us to develop PLAPACS™, a plastic packaging material with excellent moisture resistance. This product is used as a packaging component for protecting CCD and CMOS sensors from dust and moisture in the external environment.
In addition, from the perspective of protecting the environment, we are also working on the development of new materials that are suitable for lead-free solder and meet the requirements of substrates containing no halogens.
Related Links
"NEOFLEX™" flexible substrate
"PLAPACS™" lead frame type CCD packaging material
Semiconductor Process Materials
In the field of semiconductor process materials, we are developing ICROS TAPE™, a wafer back-grinding tape combining adhesive material design technology and film processing technology. The product has extremely low staining properties for wafers, and make significant contributions to streamlining processes and protecting the environment, such as eliminating the cleaning process. Furthermore, we are conducting product development suited to new processes such as heat resistance grade, light grinding grade, bumpy wafer grade, providing optimum solutions to customers.
We are also working on the development of the "Mitsui Pellicle" photo mask dust cover.
Related Links
"ICROS TAPE™" wafer back-grinding protective tape
"Mitsui Pellicle" photo mask dust cover
Imaging Materials
In the field of imaging materials, we have utilized our polymer compounding, cross-linking and denaturation technologies to develop toner resin (Toner Binder) for faster color copying and printing. This product is widely used throughout the world.
Toner
Optical Materials
In the field of optical materials, we are developing seal materials utilizing polymer compounding and hardening technologies. This product is highly regarded by many display manufactures inside and outside Japan as a sealant material for liquid crystal displays and OLED displays.
Moreover, thin-film formation technology has been applied to create products such as "SILVER REFLECTOR™" and "BRIGHT REFLECTOR™," which are reflectors for use in LCD backlights, and these are widely used in devices such as plasma televisions and PCs.
Related Link
"STRUCT BOND™" LCD sealant
Non-woven Fabrics
In the field of non-woven fabrics, we have developed the spunbonded products "SYNTEX™" and "TAFNEL™" using polyolefins as the main ingredient by utilizing our strength in possessing technology spanning from resin to processed products. These products are used in hygiene products such as disposable diapers and napkins, in addition to industrial materials such as filters and oil absorbers.
In addition, we have developed "SWP™," a synthetic pulp product using multi-branched polyolefins that only Mitsui Chemicals produces. "SWP™" is used in living materials such as tea-bags and construction materials such as paint additives and slate sheets.
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